姓 名

张晓朦

职 称

副教授

研究方向

高分子材料

邮 箱

zhangxm@zzu.edu.cn

教育和科研工作经历：

2018.12-至今，郑州大学材料科学与工程学院，讲师，直聘副教授，副教授

2014.09-2018.06，四川大学，材料学专业，博士

2010.09-2014.06，四川大学，高分子材料与工程专业，学士

研究介绍：

聚焦耐高温聚酰胺聚合及改性技术，开展特种聚酰胺聚合技术开发、机理研究及复合材料的制备与性能调控研究，以第一/通讯作者在Chemical Engineering Journal、Composites Part B: Engineering、Composites   Science and Technology等期刊发表学术论文21篇，申请/授权发明专利38项。主持国家科技重大专项课题、国家自然科学基金、河南省重大科技专项课题、中国博士后科学基金、河南省博士后科学基金、河南省科技副总项目、国家重点实验室开放课题、河南省高等学校重点科研项目计划等纵向课题8项、军工基础研究项目3项、企业委托项目4项。

荣誉与奖励：

获中国大学生高分子材料创新创业大赛一等奖、河南省教育厅优秀科技论文奖一等奖、郑州大学“三育人”先进个人、郑州大学优秀硕士/本科毕业论文指导教师、郑州大学工会积极分子等荣誉。

代表性论著：

[1] Xiaohuan Bu, Wei Zhao, Xin Li, Wenjie   Zhang, Yuancheng Zhang, Ge Shi, Yanjie He, Zhe Cui, Peng Fu, Xinchang Pang,   Hong Wu, Xiaomeng Zhang*, Minying Liu*, Large-scale fabrication of   less entangled polyamide by direct solid-state polymerization and the impact   of entanglement on crystal structure and performance, Polymer, 2025, 320,   128072.

[2] Zejun Cao, Shiyuan Zhang, Chen Wang,   Yimin Xu, Wei Zhao, Xin Li, Yuancheng Zhang, Zhe Cui, Peng Fu, Xinchang Pang,   Xiaomeng Zhang*, Minying Liu*, Reactive extrusion for efficient   preparation of high temperature resistant PA6T/66/BN composites with great   thermal management and mechanical properties, Composites Communications,   2024, 52, 102121.

[3] Shuang Li, Hangzhuo Liu, Yimin Xu, Chen   Wang, Zejun Cao, Wei Zhao, Xin Li, Yuancheng Zhang, Zhe Cui, Peng Fu,   Xinchang Pang, Xiaomeng Zhang*, Minying Liu*, Aqueous   solution-assisted in-situ polymerization for fabrication of BNNS/PA12T   nanocomposites with excellent thermal conductivity and mechanical properties,   Polymer Composites, 2024, 1-10.

[4] Xiaojie Chen, Wei Zhao, Yuancheng   Zhang, Ge Shi, Yanjie He, Zhe Cui, Peng Fu, Xinchang Pang, Xiaomeng Zhang*,   Minying Liu*, Concurrent enhancement of dimensional stability and thermal   conductivity of thermoplastic polyamide 12T/Boron nitride composites by   constructing oriented structure, Composites Communications, 2022, 33, 101193.

[5] Xiaomeng Zhang, Tingting Yin, Zejun Cao, Yimeng   Wei, Bingfeng Xue, Junle Zhang, Wenjie Zhang, Yuancheng Zhang, Ge Shi, Yanjie   He, Zhe Cui, Peng Fu, Xinchang Pang, Minying Liu,* A facile method to   fabricate water-dispersible hetero-structured AuNPs@BNNS hybrid filler and   its application for enhancing thermal conductivity, Composites   Communications, 2023, 42, 101696

[6] Minhang Chen, Tingting Yin, Peng Fu,   Haibo She, Xiaomeng Zhang*, Wei Zhao, Zhe Cui, Xinchang Pang,   Qingxiang Zhao, Minying Liu*, Construction and mechanism of 3D printed   polyamide 12/boron nitride template composites with localized and   unidirectional thermally conductive property. Composites Part B: Engineering   2021, 225, 109267.

[7] Xiaomeng Zhang, Jiajia Zhang, Lichao Xia, Jianfeng   Wang, Chunhai Li, Fang Xu, Xianlong Zhang, Hong Wu*, Shaoyun Guo*, Achieving   high-efficiency and robust 3D thermally conductive while electrically   insulating hybrid filler network with high orientation and ordered   distribution, Chemical Engineering Journal, 2018, 334, 247-256.

[8] Xiaomeng Zhang, Jiajia Zhang, Chunhai Li, Jianfeng   Wang, Lichao Xia, Fang Xu, Xianlong Zhang, Hong Wu*, Shaoyun Guo*, Endowing   the high efficiency thermally conductive and electrically insulating   composites with excellent antistatic property through selectively   multilayered distribution of diverse functional fillers, Chemical Engineering   Journal, 2017, 328, 609-618.

[9] Xiaomeng Zhang, Jiajia Zhang, Xianlong Zhang,   Chunhai Li, Jianfeng Wang, Huan Li, Lichao Xia, Hong Wu*, Shaoyun Guo*，Toward   high efficiency thermally conductive and electrically insulating pathways   through uniformly dispersed and highly oriented graphites close-packed with   SiC，Composites Science and Technology,   2017, 150, 217-226.

[10] Xiaomeng Zhang, Jiajia Zhang, Lichao Xia, Chunhai   Li, Jianfeng Wang, Fang Xu, Xianlong Zhang,Hong Wu*, and Shaoyun Guo*，Simple   and Consecutive Melt Extrusion Method to Fabricate Thermally Conductive   Composites with Highly Oriented Boron Nitrides，ACS Applied Materials &   Interfaces, 2017, 9, 22977-22984.